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Accueil du site > Recherche > Plateformes technologiques > Analyse thermique, mécanique et rhéologique > Thermal, mechanical, and rheological analysis

Thermal, mechanical, and rheological analysis

- Supervisor : Sbirrazzuoli Nicolas

- Assignments :

Thermal analysis allows to establish the relationship between chemical or physical structure and macroscopic behavior. It relies on a set of techniques based on the study of the variation of a physical property with time (isothermal mode) or temperature (dynamic mode). Thus, one can follow for example the energy exchanged between a system and a reference (DSC, calorimetry, micro-calorimetry), the evolution of mass loss (TGA) and evolved gases analysis (EGA : coupling TGA-GC/MS, TGA-IR, TGA-MS), the change in viscosity or mechanical modulii (rheometry, DMA), dielectric properties, etc..

The data obtained provide valuable information for the study and characterization of "materials" in the broadest sense of the term whose behavior is often very complex (non-equilibrium materials, viscoelastic behavior, multiphase systems, importance of observational scale phenomena, time dependence, thermodynamic and kinetic aspects, etc.).

Technological advances now allow measurement and careful control of temperature between -150 ° C and 1600 ° C and whatever the temperature program selected (linear heating, heating-cooling-isothermal step cycles, sinusoidal or stochastic temperature programmation). Moreover, one can easily modulate the rate of heating or cooling with high accuracy from ± 0.02 to ± 50 K/min, and even much more : 300 000 K/min for FlashDSC (Ultra Fast Calorimetry) ! Finally, it is possible to work under controlled atmosphere and to study solid/gas reactions such as degradation, oxidation, hydrogenation, etc.

- Available techniques :

  • Thermogravimetric analysis (TGA, from 20 to 1600 ° C, 0.1 micrograms), Coupling TGA / GC-MS
  • Differential Scanning Calorimetry (DSC, -150 ° C, 800 ° C), Temperature Modulated DSC (TMDSC) and stochastic perturbation temperature DSC (TOPEM)
  • Ultra Fast Calorimetry (FlashDSC, -95°C, 450°C, heating rates up to 2 400 000 K/min and cooling rates up to 240 000 K/min)
  • Reaction Calorimetry (RC) and C80
  • Dynamic rheometry (-150 ° C, 500 ° C)
  • Dynamic Mechanical Analysis (DMA, -150 ° C, 500 ° C)
  • Tensile, bending, compression tests (10 kN).
  • Thermomicroscopy with polarized light (-150, 350 ° C) and image processing
  • Hot press with temperature control (200 bars, 300°C)

- Applications :

  • Pharmaceuticals, Cosmetics and Food
  • Materials and Polymers
  • Life sciences, Biology and Biochemistry
  • Safety of chemical reactions and Environment

- Picture of the platform :

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